Ihre Kommentare wurden gesendet. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. CPU Cache is an area of fast memory located on the processor. Contact your OEM or reseller for warranty support. What is the difference between Boxed and Tray Processors? Der angezeigte Wert gibt an, mit welchem Intel Befehlssatz dieser Prozessor kompatibel ist.
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If sold in bulk, price represents individual unit. Intek balances performance and power requirements across system workloads to represent real-world power usage. Intel processor numbers are not a measure of performance. Physical Address Extensions PAE is a feature that allows bit processors to access a physical address space larger than 4 gigabytes.
Die Prozessornummern bezeichnen Unterschiede innerhalb einer bestimmten Prozessorfamilie, nicht zwischen Prozessorfamilien.
Embedded Options Inteel indicates products that offer extended purchase availability for intelligent systems and embedded solutions. You will receive a reply within 2 business days. For benchmarking data see http: Add to Compare Shop for this product. The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Die Informationen werden in der vorliegenden Form bereitgestellt. Frequency is measured in gigahertz GHzor billion cycles per second.
What is the difference between Boxed and Tray Processors? Core i7 Product Number: Highly threaded applications can get more work done in parallel, completing tasks sooner. Prices may vary for other package types and shipment quantities.
Refer to Datasheet for formal definitions of product properties and features. Idle States C-states are used to save power when the processor is idle.
Downloads for Intel® Core™ Duo Processor T2300 (2M Cache, 1.66 GHz, 667 MHz FSB)
The processor base frequency is the operating point where TDP is defined. Im Datenblatt finden Sie offizielle Definitionen von Produkteigenschaften und -funktionen.
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Your personal information will be used to respond to this inquiry only. Benchmarkdaten finden Sie unter http: CPU Cache is an area of fast memory located on the processor.
Please submit your comments, questions, or suggestions here. Cores is a hardware term that describes the number of independent central processing units gebuine a single computing component die or chip.
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Your name and email address will not be added to any mailing list, and you will not receive email from Intel Corporation unless requested. Clear queue Compare 0. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Note that ECC memory support requires both processor and chipset support. Der Sockel ist die Komponente, die die mechanischen und elektrischen Verbindungen zwischen dem Prozessor und dem Mainboard bietet.
Linux PC (Genuine Intel(R) CPU T @ GHz) – Geekbench Browser
See your Intel representative for details. Support Home Product Specifications Processors. You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways.